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X11DSN-TSQ

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    1. Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
    2. Intel® C627
    3. Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 12 DIMM slots
    4. 2 PCI-E 3.0 x32 Riser Slot
      M.2 Interface: 1 PCI-E 3.0 x4
      M.2 Form Factor: 2242/2260/2280
      M.2 Key: M-Key
    5. 1 VGA D-Sub Connector port
    6. Dual LAN with 10GBase-T with Intel® X557